Centrino

Centrino adalah salah satu daripada strategi pemasaran dari Intel, di mana sesebuah komputer riba perlu menggunakan pemproses, chipset papan induk dan kad wayarles yang diiktiraf oleh Intel. Intel menyatakan bahawa sistem yang berteraskan Centrino mempunyai prestasi yang lebih baik, jangka hayat bateri yang lebih lama dan capaian rangkaian tanpa dawai yang lebih bagus.

Untuk medapatkan label Centrino, penjual komputer riba wajib menggunakan ketiga-tiga bahagian yang diiktiraf Intel. Komputer yang menggunakan cuma CPU dan chipset sahaja sebaliknya akan diberi label Intel Core 2.

Intel Centrino[sunting | sunting sumber]

Wireless LAN	Chipset	Centrino	Processor	Codename	Release Date	Manufacturing Technology	Microarchitecture
Intel Wireless Products	800 Series	Carmel	Intel Pentium M	Banias	2003	130 nm	Intel P6
				Dothan	2004	90 nm
	900 Series	Sonoma			2005
		Napa	Intel Core Duo/Solo	Yonah	2006	65 nm
			Intel Core 2 Duo/Solo	Merom			Intel Core
		Santa Rosa	Intel Core 2 Duo		2007
				Penryn	2008	45 nm
	4 Series	Montevina
	5 Series	Calpella	Intel Core i7/i7 Extreme Edition	Clarksfield	2009		Intel Nehalem
			Intel Core i3/i5/i7	Arrandale	2010	32 nm
	6 Series	Huron River	Intel Core i3/i5/i7/i7 Extreme Edition	Sandy Bridge	2011		Intel Sandy Bridge
	7 Series	Chief River	Intel Core i3/i5/i7/i7 Extreme Edition	Ivy Bridge	2012	22 nm
	8 Series	Shark Bay	Intel Core i3/i5/i7/i7 Extreme Edition	Haswell	2013		Intel Haswell
	9 Series	?		Broadwell	2014	14 nm

Pelaksanaan[sunting | sunting sumber]

Pelantar Carmel (2003)[sunting | sunting sumber]

Pada bulan Mac 2003, Intel telah memperkenalkan generasi pertama pelantar Centrino dengan nama kod Carmel.

Centrino	Pelantar Carmel
Set cip	siri Intel 855 (nama kod Odem atau Montara dengan Intel Extreme Graphics 2), DDR-266 atau DDR-333.
Pemproses	Intel Pentium M (nama kod Banias atau kemudiannya Dothan) dengan 400 MT/s FSB, Soket 479.
Rangkaian Tanpa-Wayar	Intel PRO/Wireless 2100B (nama kod Calexico) atau kemudiannya penyesuai Wi-Fi 2200BG mini-PCI (nama kod Calexico2).

Pada mulanya, pemerhati industri telah mengecam pelantar Carmel diatas kelembapan menyeragamkannya dengan IEEE 802.11g, kerana banyak pengeluar chip Wi-Fi bebas seperti Broadcom dan Atheros telah pun memulakan pengeluaran produk 802.11g. Intel membalas dengan mengatakan IEEE belum menyudahkan piawaian 802.11g semasa Carmel diperkenalkan, dan mereka cuma mahu melancarkan produk berdasarkan piawaian terakhir. Selepas piawaian 802.11g dimuktamadkan pada awal 2004, Intel telah melancarkan Intel PRO/Wireless 2200BG untuk menggantikan 2100. Pada masa yang sama, mereka memperkenalkan Dothan Pentium M untuk menggantikan Banias Pentium M. Pada mulanya, Intel hanya melancarkan chipset 855GM, yang mana tidak menyokong grafik luaran. Kemudiannya, barulah Intel memperkenalkan chip 855GME dan 855PM, yang menyokong grafik luaran pada laptop Centrino.

Walaupun menerima kritikan, pelantar Carmel berjaya diterima dengan baik oleh OEM dan pengguna. Carmel boleh mencapai atau melebihi kemampuan pelantar Pentium 4-M yang lama, dan membenarkan operasi komputer riba sehingga 4 ke 5 jam menggunakan bateri 48 W-h. Carmel juga membolehkan pengeluar merekabentuk komputer riba yang lebih nipis dan ringan kerana komponennya tidak membebaskan banyak haba, dan oleh itu tidak memerlukan sistem penyejuk yang besar.

Pelantar Sonoma (2005)[sunting | sunting sumber]

Intel menggunakan Sonoma sebagai nama kod generasi kedua pelantar Centrino yang diperkenalkan pada Januari 2005.

Centrino	Pelantar Sonoma
Set cip	siri Intel Mobile 915 Express (nama kod Alviso dengan Intel GMA 900), DDR2-533.
Pemproses	pemproses Intel Pentium M (nama kod Dothan) dengan 533 MT/s FSB, Soket 479.
Rangkaian Tanpa-Wayar	Intel PRO/Wireless 2200BG atau penyesuai Wi-Fi 2915ABG mini-PCI (kedua-duanya menggunakan nama kod Calexico2).

Set cip Mobile 915 Express, sebagaimana versi desktop, menyokong kebanyakan ciri baru seperti DDR2, PCI Express, Intel High Definition Audio, dan SATA. Malangnya, pengenalan kepada PCI Express dan Pemproses Pentium M yang lebih laju menyebabkan komputer riba yang dibina atas pelantar Sonoma mempunyai jangka hayat bateri yang lebih pendek daripada pelantar Carmel; komputer riba dalam pelantar Sonoma biasanya mencapai jangka hayat bateri antara 3.5 hingga 4.6 jam menggunakan bateri berkuasa 53 W-h.

Pelantar Napa (2006)[sunting | sunting sumber]

Nama kod Napa menandakan pelantar Centrino generasi ke-3, diperkenalkan pada Januari 2006 di Consumer Electronics Show musim sejuk. Pada mulanya pelantar ini hanya menyokong pemproses Intel Core Duo tetapi bermula 27 Julai 2006, ia turut menyokong pemproses yang terbaharu, Intel Core 2 Duo.

Centrino	Pelantar Napa
Cip set	Siri Intel Mobile 945 Express (nama kod Calistoga dengan Intel GMA 950), termasuk ICH7M southbridge. Menyokong RAM DDR2-533 dan DDR2-667 SO-DIMM.
Pemproses	Pemproses - Socket M / Micro-FCBGA Pemproses Intel Core Solo, Core Duo (nama kod Yonah), atau Pemproses Intel Core 2 Duo (nama kod Merom) dengan 667 MT/s FSB untuk pelantar Napa terbaru, atau Pemproses Intel Core 2 Solo (nama kod Merom) dengan 553 MT/s FSB untuk pelantar Napa terbaru (Sep 2007).
Rangkaian Tanpa-Wayar	Penyesuai Wi-Fi Intel PRO/Wireless 3945ABG mini-PCIe (nama kod Golan). Beberapa model baru (suku pertama 2007) untuk pelantar Napa mengandungi kad tanpa-wayar 4965AGN (a/b/g/draft-n) yang terbaru

Intel menggunakan penjenamaan Centrino Duo untuk komputer riba dengan pemproses dwi-teras ("Core Duo") dan ("Core 2 Duo") dan mengekalkan nama Centrino untuk komputer riba dengan pemproses teras tunggal ("Core Solo"). Sebahagian komputer riba Core Duo yang terdahulu masih menggunakan label Intel Centrino berbanding Centrino Duo seperti yang sepatutnya.

Santa Rosa platform (2007)[sunting | sunting sumber]

The codename Santa Rosa refers to the fourth-generation Centrino platform, which was released on Wednesday May 9, 2007.

Centrino	Santa Rosa platform
Mobile chipset	an Intel Mobile 965 Express series chipset (codenamed Crestline): GM965 with Intel's GMA X3100 graphics technology or PM965 with discrete graphics, and ICH8M southbridge, 800 MT/s front side bus with Dynamic Front Side Bus Switching to save power during low utilization. Intel Dynamic Acceleration (IDA), better Windows Vista Aero support.^[1] RAM supported for DDR2-533 and DDR2-667 SO-DIMM. EFI-compliant firmware, a successor to BIOS. optional NAND flash-memory caching branded as Intel Turbo Memory (codenamed Robson).
Mobile processor	Processors - Socket P / Micro-FCPGA / Micro-FCBGA an Intel Core 2 Duo (codenamed Merom) second generation processor with 800 MT/s FSB, or an Intel Core 2 Duo (codenamed Penryn) 45nm processor with 800 MT/s FSB and SSE4.1, which will add 47 new instructions to SSSE3. It was scheduled for release in January 2008^[2] for Santa Rosa Refresh platform.
Wireless network	an Intel WiFi Link 4965AGN (a/b/g/draft-n) mini-PCIe Wi-Fi adapter (codenamed Kedron). Wireless-N technology boasts a 5X speed increase, along with a 2X greater coverage area, and supports 2.4 GHz and 5 GHz signal bands, with enough bandwidth for high definition audio and video streams.^[3].

The Santa Rosa platform comes with dynamic acceleration technology, allowing single threaded applications to execute faster. When a single threaded application is running, the CPU can turn off one of its cores and overclock the active core. In this way the CPU maintains the same Thermal Profile as it would when both cores are active. Santa Rosa performs well as a mobile gaming platform due to its ability to switch between single threaded and multithreaded tasks. ^[4] Other power savings come from an Enhanced Sleep state where both the CPU cores and the chipset will power down.

The wireless chipset update was originally intended to include WWAN Internet access via HSDPA (3.5G), (codenamed Windigo) co-developed with Nokia.^[5]^[6] After announcing a working partnership, both later retracted the deal citing the lack of a clear business case for the technology. Support for WiMAX (802.16) was originally scheduled for inclusion in Santa Rosa but appears to have been delayed until Montevina in 2008 ^[5].

It is branded as "Centrino Pro" when combined with the enhanced security technologies Intel introduced with vPro and "Centrino Duo" when they are not used. ^[7]

Montevina platform (2008)[sunting | sunting sumber]

The codename Montevina refers to the fifth-generation Centrino platform, now formally named Centrino 2 to avoid confusion with previous Centrino platforms. It was scheduled for release at Computex Taipei 2008, which took place on June 3–7, 2008,^[8] but was delayed until July 15, due to problems with integrated graphics and wireless certification.^[9]

Centrino	Montevina platform
Mobile chipset	an Intel Mobile 4 Express series chipset (codenamed Cantiga; GL40, GS45, GM45, PM45) with Intel's GMA X4500 graphics technology and ICH9M southbridge, 1066 MT/s (667 MT/s for GL40) front side bus. The GM45/GS45 graphics core is clocked at 533MHz and 380MHz for GL40, which contains ten unified shaders, up from the eight provided by GMA X3100. RAM support for DDR2-667, DDR2-800, DDR3-800, DDR3-1066 SO-DIMM. (GL40 does not support DDR3-1066) NAND flash-memory caching branded as Intel Turbo Memory (codenamed Robson 2). Gigabit Ethernet LAN controllers 82567LM and 82567LF (codenamed Boazman).^[10] Main support for DisplayPort with an external connector attached to the motherboard along with full supplemental support of HDMI, DVI, and VGA standards.
Mobile processor	Processors - Socket P / Micro-FCPGA / Micro-FCBGA a second-generation Intel Core 2 Duo (codenamed Penryn) 45nm processor with 800-1066 MT/s FSB with clock speeds ranging from 2 GHz to 3.06 GHz, also featuring SSE4.1 support, which adds 47 new instructions to SSSE3. It was planned to consume no more than 29W, compared to Merom's and first-generation Penryn's 34W TDP. But after release only a few models (P series) have 25W TDP and the rest (T series) still have 35W TDP, besides the Q series (Quad core) TDP is 45W.
Wireless network	Wireless Modules Intel Ultimate N WiFi Link 5300 mini-PCIe adapter (codenamed Shirley Peak 3x3) supporting up to 450Mbit/s, or Intel WiFi Link 5100 mini-PCIe adapter (codenamed Shirley Peak 1x2) supporting up to 300Mbit/s Rx / 150Mbit/s Tx, or Intel WiMAX/WiFi Link 5350 mini-PCIe adapter (code-named Echo Peak-P) supporting both WiMAX and up to 450Mbit/s Wi-Fi, or Intel WiMAX/WiFi Link 5150 mini-PCIe adapter (code-named Echo Peak-V) supporting both WiMAX and up to 300Mbit/s Rx / 150Mbit/s Tx Wi-Fi

It is branded as Centrino 2 vPro when combined with built-in security and manageability features technologies.

Calpella platform (2009)[sunting | sunting sumber]

The codename Calpella refers to the sixth-generation Centrino platform; it will be competing with the AMD Fusion platform. Though originally scheduled to premiere in Q3 2009 with the second iteration of Nehalem processors,^[11] Intel has stated that due to pressure from computer manufacturers, they will delay the release of the platform until at least October 2009 (Q4 2009) to allowed OEM partners to clear excess inventory for existing chips. This is believed to be spurred by the lowered demand due to the current unfavorable economic conditions.^[12]

Centrino	Calpella platform
Mobile chipset	an Intel Mobile Express Series 5 chipset with Intel's graphics technology that will allow for optimized decoding/encoding and editing/playback of H.264/MPEG-4 AVC video used in Blu-ray Discs and HD 1080p video, optimized for MPEG-2 (DVD) video playback and editing. Intel QuickPath Interconnect support which directly connects to the CPU, removing the outdated FSB technology. Direct connect to DisplayPort with DPCP as with its predecessor along with legacy support for HDMI (and HDCP), DVI, and VGA. RAM supported for DDR3-800, DDR3-1066, DDR3-1333 and DDR3-1600 SO-DIMM. Solid-state drive or Hybrid hard drives support.
Mobile processor	Processors - based on Intel Nehalem microarchitecture (codenamed Gilo) an Intel Core i7 processor (codenamed Clarksfield) 45nm for Quad Core version, 45-55W TDP. an Intel Core i5 or i7 processor (codenamed Arrandale) 32nm.
Wireless network	Wireless Modules Advanced-N + WiMAX 6250, Ultimate-N 6300, Advanced-N 6200 or Wireless-N 1000.

Lihat juga[sunting | sunting sumber]

Rujukan[sunting | sunting sumber]

^ "Intel dumbs down dual Santa Rosa cores with IDA - The INQUIRER". Diarkibkan daripada yang asal pada 2013-01-12. Dicapai pada 2008-02-18.
^ Intel Previews a New Family of Power-Saving Chips - New York Times
^ Rickwood, Lee. "Intel Unveils Next Gen Processor". PCWorld.ca. Diarkibkan daripada yang asal pada 2007-09-28. Dicapai pada 2007-05-09.
^ Santa Rosa Revealed, TrustedReviews
^ ^a ^b Intel Wireless Connectivity Roadmap, The Register
^ Intel, NextGen feature Nokia chip, CNET
^ Santa Rosa officially dubbed Centrino Pro, engadget
^ Kim, Arnold (2008-02-18). "Intel Processors and Platform (Montevina) Due in June 2008". MacRumors.com.
^ Kircos, Bill (2008-05-28). "Intel Delays Next-Generation Centrino Chipset". pcmag.com. Diarkibkan daripada yang asal pada 2009-05-02. Dicapai pada 2009-08-01.
^ Tony Smith (2006-10-11). "Intel to follow 'Santa Rosa' Centrino with 'Montevina'". The Register. Diarkibkan daripada yang asal pada 2008-10-07. Dicapai pada 2008-02-18.
^ "Intel to launch Calpella notebook platform in 3Q09". digitimes.com. 2008-08-05.
^ "Notebook vendors looking for delay of Intel's Calpella platform". digitimes.com. 2009-01-05.

Pautan luar[sunting | sunting sumber]

[1] "Intel dumbs down dual Santa Rosa cores with IDA - The INQUIRER". Diarkibkan daripada yang asal pada 2013-01-12. Dicapai pada 2008-02-18.

[2] Intel Previews a New Family of Power-Saving Chips - New York Times

[3] Rickwood, Lee. "Intel Unveils Next Gen Processor". PCWorld.ca. Diarkibkan daripada yang asal pada 2007-09-28. Dicapai pada 2007-05-09.

[4] Santa Rosa Revealed, TrustedReviews

[Intel_Wireless_Roadmap-5] Intel Wireless Connectivity Roadmap, The Register

[6] Intel, NextGen feature Nokia chip, CNET

[7] Santa Rosa officially dubbed Centrino Pro, engadget

[8] Kim, Arnold (2008-02-18). "Intel Processors and Platform (Montevina) Due in June 2008". MacRumors.com.

[9] Kircos, Bill (2008-05-28). "Intel Delays Next-Generation Centrino Chipset". pcmag.com. Diarkibkan daripada yang asal pada 2009-05-02. Dicapai pada 2009-08-01.

[10] Tony Smith (2006-10-11). "Intel to follow 'Santa Rosa' Centrino with 'Montevina'". The Register. Diarkibkan daripada yang asal pada 2008-10-07. Dicapai pada 2008-02-18.

[11] "Intel to launch Calpella notebook platform in 3Q09". digitimes.com. 2008-08-05.

[12] "Notebook vendors looking for delay of Intel's Calpella platform". digitimes.com. 2009-01-05.

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